When it comes to soldering of electrical components on to printed circuit board (PCB), surface mount technology (SMT) is the most widely used method. The SMT reflow soldering oven is the machine that has greatly contributed to this technology. Highly technical principles in bonding are all put together to ensure optimal functionality of this particular machine that has literally transformed the electronics industry. In addition to precise control of this process, the machine consumes less power than other methods used and produces more products per unit time than any other method.
This attaching electronics to PCB requires heating of soldering paste so that it attaches electronics on the pad on solidifying. This requires a complicated and an efficient technique, and there currently better technology to do this than an SMT reflow soldering model.
The beginning point is making of the soldering paste. This is a mixture of flux, some chemical used as cleaning agent and small solder particles. This makes a sticky paste that is used to loosely hold the electronics on to their predetermined positions on the PCB.
The PCB and loosely attached components is then drawn into the heating chambers through a conveyor belt. This then undergoes into four distinct phases in this machine. The first phase is known as preheat zone. This is where the melting point of the solvent is set. The ramp rate (time/temperature rate) is also determined and used to control heating in the following stages.
This is followed by thermal soak zone where the PCB and its components are exposed to heating at specific temperature for between 60 to 120 seconds to remove paste volatiles. The third stage is reflow zone. At this stage, PCB gets exposed to the maximum possible temperature that is tolerable by all the electronics on it. This is usually set below the liquidus temperature-the temperature above which the electronics get destroyed. At this point, the surface tension at the joints and the joints is reduced, melting the solder and as such bonding the pads and electronics.
The cooling zone is the last phase where controlled cooling is done to avoid thermal shock. This result of this is permanent bonding of the electrical components to PCB ready for use in electronic market after cleaning and testing.
The oven gets heated by ceramic heaters and heat transfer to the assembly points can be through radiation (hot air) or the infrared electromagnetic radiation depending on the machine make. Other technologies of heat transfer are also used.
These machines have gained favor with electronic assemblers for various reasons. These include simple methods of operating, faster production, high level of accuracy, produces much more component per unit time than any other method. In addition to this, depending on the model, it is possible to attach the components on both sides of PCB and there is efficiency in electricity utilization.
In order to remain relevant in electrical assembly industry, just like any other industry, it is important to use highly efficient and most up-to-date technology. There are latest models SMT reflow soldering oven that offers efficiency level that results to high productivity and profitability to a firm.
This attaching electronics to PCB requires heating of soldering paste so that it attaches electronics on the pad on solidifying. This requires a complicated and an efficient technique, and there currently better technology to do this than an SMT reflow soldering model.
The beginning point is making of the soldering paste. This is a mixture of flux, some chemical used as cleaning agent and small solder particles. This makes a sticky paste that is used to loosely hold the electronics on to their predetermined positions on the PCB.
The PCB and loosely attached components is then drawn into the heating chambers through a conveyor belt. This then undergoes into four distinct phases in this machine. The first phase is known as preheat zone. This is where the melting point of the solvent is set. The ramp rate (time/temperature rate) is also determined and used to control heating in the following stages.
This is followed by thermal soak zone where the PCB and its components are exposed to heating at specific temperature for between 60 to 120 seconds to remove paste volatiles. The third stage is reflow zone. At this stage, PCB gets exposed to the maximum possible temperature that is tolerable by all the electronics on it. This is usually set below the liquidus temperature-the temperature above which the electronics get destroyed. At this point, the surface tension at the joints and the joints is reduced, melting the solder and as such bonding the pads and electronics.
The cooling zone is the last phase where controlled cooling is done to avoid thermal shock. This result of this is permanent bonding of the electrical components to PCB ready for use in electronic market after cleaning and testing.
The oven gets heated by ceramic heaters and heat transfer to the assembly points can be through radiation (hot air) or the infrared electromagnetic radiation depending on the machine make. Other technologies of heat transfer are also used.
These machines have gained favor with electronic assemblers for various reasons. These include simple methods of operating, faster production, high level of accuracy, produces much more component per unit time than any other method. In addition to this, depending on the model, it is possible to attach the components on both sides of PCB and there is efficiency in electricity utilization.
In order to remain relevant in electrical assembly industry, just like any other industry, it is important to use highly efficient and most up-to-date technology. There are latest models SMT reflow soldering oven that offers efficiency level that results to high productivity and profitability to a firm.
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